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Application Note AN-1028

Application Note AN-1028-2025

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Application Note AN-1028 provides comprehensive design, integration, and rework guidelines for BGA (Ball Grid Array) and LGA (Land Grid Array) packages. It covers essential topics such as PCB layout, solder mask openings, assembly considerations, stencil design, solder pastes, reflow processes, inspection methods, and rework procedures to ensure optimal performance and reliability of these microelectronic devices.

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What is the thermal resistance of SOT 223?

3-2 Thermal Performance Enhancerment of SOT-223 Package When IC is mounted to the standard footprint (16mm2), the thermal resistance JA is 135C/W, adding copper area of pad to 100mm2 under the package reduces the JA to 107C/W.

What is a good thermal resistance value?

R-value measures an insulation materials ability to resist heat flow and is expressed in mK/W. A good R-value depends on the specific application and climate, but generally, in the UK, its 3.30 mK/W for walls and 4.54 mK/W for roofs.

How to find total thermal resistance?

When a TO-220 package is used without a heatsink, the package acts as its own heatsink, and the heatsink-to-ambient thermal resistance in air for a TO-220 package is approximately 70 C/W. The junction-to-air thermal resistance of the LM317 voltage regulator (National Semiconductors, page 5, TO200 version) is 50 C/W.

What is the thermal conductivity of a solder mask?

The units for thermal resistance are Kelvins per watt (K/W). By definition, thermal resistance R is the ratio of the temperature difference T2 T1 and the heat flow Q12 between two points. The thermal resistance formula is the following: R = (T2 T1) / Q.

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