Jep122 2026

The document is a JEDEC publication titled 'Failure Mechanisms and Models for Semiconductor Devices' (JEP122C), which provides comprehensive guidance on various failure mechanisms affecting semiconductor devices. It includes definitions, models for common failure mechanisms such as electromigration, corrosion, time-dependent dielectric breakdown, and hot carrier injection, along with their associated activation energies and factors. The publication aims to assist in estimating system failure rates using accelerated test conditions and outlines methodologies for reliability analysis. It serves as a resource for manufacturers and purchasers to enhance product reliability and understanding of semiconductor device failures.