SECTION 16453 - DATA TELECOMMUNICATION GROUNDING 2025

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The ANSI/EIA/TIA-607 standard is the commercial building grounding and bonding requirements for telecommunications. The primary objective of this standard is to provide guidance around the issue of bonding and grounding as it relates to building telecommunications infrastructure.
Article 250 of the NEC covers the grounding and bonding of electrical systems. By definition, as well as by function, grounding and bonding are not the same thing. However, they do work closely together in a yin-and-yang relationship to help ensure safety in electrical systems.
250.66(A) Size of Alternating-Current Grounding Electrode Conductor. Connections to a Rod, Pipe, or Plate Electrode(s). The grounding electrode conductor to the ground rod is not required to be larger than 6 AWG copper or 4 AWG aluminum.
The telecommunications grounding and bonding infrastructure originates with a connection to the service equipment (or power) ground and extends throughout the building, interconnecting all the telecom spaces throughout the building via the telecom pathways.
Section 517.13(A) requires branch circuits to be installed in a metal raceway system or a cable having a metallic armor or sheath assembly. The metal raceway system, metallic cable armor, or sheath assembly must qualify as an equipment grounding conductor (EGC) as specified in Sec.
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NEC (National Electrical Code) Article 250 covers grounding and bonding for electrical installations to protect from electrical shock and ensure correct operation of the electrical system.
Ground rods less than 0.625 in diameter With regard to diameter requirements, NEC 250.52(A) (5)(b) states, Grounding electrodes of stainless steel and copper or zinc coated steel shall be at least 15.87 mm (5/8 in.) in diameter, unless listed and not less than 12.70 mm (1/2 in.) in diameter.

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