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Packaged integrated circuit devices with through - Google Books 2025

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The document US 20100320585A1 describes a patent application for packaged integrated circuit devices that incorporate through-body conductive vias. It outlines methods for manufacturing these devices, which include embedding integrated circuit dies within encapsulant material and establishing electrical connections via conductive vias. The invention aims to improve the packaging density and efficiency of integrated circuits by allowing multiple dies to be stacked and interconnected effectively.

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