Polishing technique for geologic samples Josrpu E Teccenr, Jn - minsocam 2025

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A process to generate a reflective surface. Normally, the polish is generated by using a fine-micron or sub-micron abrasive particle in combination with a liquid. Polishing is a wet process.
Polishing is a processing technique that removes irregularities on the surface of a product using abrasive grains. Since it can be adjusted in um (micrometer) and micron units, it is often used in the final process of product processing.
At a microscopic level, even seemingly smooth surfaces have peaks and valleys. The polishing process systematically removes these irregularities by: Material Removal - Abrasive particles in the polishing compound scratch the surface, removing minute amounts of material.
Mechanical grinding and polishing consists of removing material from a specimen with increasingly fine grit grinding paper or polishing compounds (typically performed on a rotating wheel platen).
Specimen surfaces can be polished by diamond suspensions of successively finer particle sizes. Those particles can be in sub-micro or nano sizes. For example, Sakulich et al. [69] used a series of graded sized particles from 9 m to 0.05 m for fine polishing.
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The first is usually very aggressive, typically wet sanding or a heavy abrasive with a heavy cut pad, like M105 and a MF cut pad. 2nd stage is to refine the heavy cut, so something like a low abrasion compound or a more aggressive polish, and the 3rd stage being fine polish.