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Today were going to talk about the storage and handling of moisture sensitive devices. Any plastic IC package will absorb moisture from the air When the package is exposed to the sudden high temperatures of solder reflow this moisture can expand rapidly and damage the component. Sometimes the damage is visible such as cracks in the package other times its internal and its not visible, but it can mean early product failure. The smaller, thinner packages with less space around the die are more prone to this type of damage. Moisture sensor devices can be ICs, LEDs and even connectors. They require special handling and record keeping. These parts arrive at our facility in special moisture barrier bags. The bags are labeled with the moisture sensitivity level and other information. We inspect the bags for tears and store them until we need the parts for assembly. We dont open the bag until we are ready to use the parts. Each bag should contain a humidity indicator card which we use to
