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This video is for engineers challenged by voiding in die-attach applications. It will cover causes and methods to Avoid the Void. Andy, with regard to voids in die-attachment. What causes them? First of all, soldering is a phase inversion process, that the solid soldering material melts, and then the fluid materials, which previously were present as the continuous phase, now become the discontinuous phase. They become potentially bubbles of voids within the reflow solder itself, so that you have an entrapment of these kinds of holes within the solder matrix. Thermodynamics tells you that from the surface tension of the solder, even the high lead solders are fairly high surface statutes. If you want to minimize the free energy of the system, you want to eliminate the void to eliminate the surface area that is there, and release the energy. What that means is, thereamp;#39;s always something that pins the void in place. Thatamp;#39;s why this kind of phrase is about pinning the void i
