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For years, people have been using gold-tin in high-temperature applications, but we have the ongoing problem of voiding. Its not just high-temperature applications, but LED applications where the high thermal electrical connectivity are a prerequisite for the usefulness of the solder. What weve noticed is that, in the last several years because people have been using gold plating on both the die side, and on the substrate side, certainly the substrate side in some instances, theres been an increase in voiding thats been seen, and it seems to correlate with the amount of gold thats present from those. We took a look a while back at the ratio of gold thats present in terms of thickness on both the die and substrate. And tolerated that with the amount of voiding, and, again, showed that there was docHub correlation between the two. What seems to be happening is the gold-tin eutectic is actually being pushed away from its minimum point at 280 degrees C, off to one side, and you