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hi welcome to part three of the BGA rework primer where weamp;#39;re going to be talking about device placement when weamp;#39;re talking about the device placement we want to make sure that the device after being removed or the rework area device is removed and the site is dressed that placement is rwn accurately and properly the third part of our process in this series on the BGA rework a primer series is the placement process and the objective here is to as accurately as possible place the BGA so that the acceptance criteria from the client or that weamp;#39;re working towards can be met again when we do the placement process we donamp;#39;t want to destroy nearby components or the laminate one of the methods that has really brought to light specifically for the NPI process or for the repair process are the stay-in place stencils in this technique a stencil is placed onto the board thatamp;#39;s already been prepped and cleaned and inspected and we can see that in this Photogra