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hi this is bob wetterman from best incorporated in this session on bga rework a primer this is the second in our series and when weamp;#39;ll be dealing with today is the topic of sight dressing our previous discussion we talked about the removal of devices in this section weamp;#39;re going to be talking about the dressing or the preparation of the site prior to placement of the bga so the objective of sight dressing is to properly clean up the remaining solder and in some cases remove the lead to less than 0.1 percent led by weight flatten the solder without damaging the pcb or the nearby components so thatamp;#39;s the objective of this the second step in the bga rework process now thereamp;#39;s a variety of different methods one can use for the site dressing once the device has come off the most common for most rework jobs is by the use of a blade tip or a soldering iron and wick usually associated and in combination with flux so after the bga is removed there is residual sold
