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welcome to items course on pin and paste process this course will be presented in a multi-part series this is part 1 introduction to pin and paste process in part one of this series weamp;#39;ll just cover the basics will answer the question what is the pen and paste process weamp;#39;ll talk about incentives and weamp;#39;ll talk about solder joint specifications so start from the beginning and answer our first question what is dependent paste process the pen and paste process refers to the use of solder reflow technology to solder through-hole and odd form components on PCBs with both surface mounted and through-hole components the through-hole components are typically soldered after the surface mount components this is done either by hand or using a wave solder machine the pin and paste process allows through-hole components to be soldered at the same time and using the same process as surface mounted components letamp;#39;s take a look at an assembly process for a circuit board