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the first wave of RFID adoption is behind us and a new one is underway from wearable technology to inventory management early adopters of RFID from a wide variety of industries continue to find helpful use cases for this intelligent labels technology from Beauty food aviation and beyond RFID capability can be integrated into an existing conversion process for the addition of an insertion module the RFID converting process is comprised of in lay carrier antenna chip and struck drying lays are non adhesive and require adhesive application allowing high volume or productivity in the converting process first the base liner is delaminated by separating the base material and liner each inlay is read and verified individually before insertion the RFID inlays are then cut and dispensed onto the face with adhesive ing to the required product pitch off pitch dry inlay regulates the pitch by regulating the insertion speed then cutting one by one inlay with on pitch lamination rfid can be integrat