VIA may not always be the best with which to work. Even though many editing capabilities are out there, not all offer a easy solution. We developed DocHub to make editing effortless, no matter the document format. With DocHub, you can quickly and easily fill in size in VIA. On top of that, DocHub delivers a variety of additional tools including document generation, automation and management, field-compliant eSignature services, and integrations.
DocHub also helps you save effort by creating document templates from documents that you utilize frequently. On top of that, you can benefit from our a lot of integrations that enable you to connect our editor to your most utilized apps effortlessly. Such a solution makes it fast and simple to deal with your files without any slowdowns.
DocHub is a handy feature for personal and corporate use. Not only does it offer a comprehensive collection of capabilities for document creation and editing, and eSignature integration, but it also has a variety of capabilities that come in handy for developing complex and streamlined workflows. Anything uploaded to our editor is saved secure in accordance with major industry requirements that shield users' data.
Make DocHub your go-to option and simplify your document-driven workflows effortlessly!
you guys foreign um just to give everyone a little update as to where asc is currently working with the asap process iamp;#39;m going to build a little bit upon what harris talked about uh it does require a lithography change one of the fundamental changes we make is using a thinner more advanced by more advanced it just means uh kind of a more leading edge technology dry film typically weamp;#39;re changing from our standard 50 micron dry film down in the neighborhood of 25 and 30 micron that is really just a nod to try to be able to maintain some capability of putting a mill of copper in the hole because remember on outer layers weamp;#39;re generally trying to plate the circuitry and the holes at the same time so your minimum plating thickness requirement in your hole is going to have a direct impact on what youamp;#39;re going to be building into those dry film valleys weamp;#39;ll call them to form your circuitry so we need to be aware of that because if we push much