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foreign design Iamp;#39;m Dr Adam tieman of the annex Labs at Barry lawn University and now weamp;#39;ll go on with part two of lecture 11 chip finishing and sign off as I mentioned before this chapter is about actually finishing the chip so letamp;#39;s go over an overview of how we finish a chip at the very least weamp;#39;ll start with inserting fillers and decaps then weamp;#39;ll apply dfm designed for manufacturing in dfy designed for yield rules weamp;#39;ll go on to antenna checking metal filling and slotting IR dropping electromagration analysis logic equivalents layout physical verification add a sealering and there are probably several other steps that I havenamp;#39;t remembered to put in here so letamp;#39;s go over these steps or some of these steps so letamp;#39;s start with filler cell insertion so as we saw before standard cell placement never docHubes 100 utilization we now know why I mean we left a lot of room for optimization we left room for