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[Music] you guys foreign um just to give everyone a little update as to where asc is currently working with the asap process im going to build a little bit upon what harris talked about uh it does require a lithography change one of the fundamental changes we make is using a thinner more advanced by more advanced it just means uh kind of a more leading edge technology dry film typically were changing from our standard 50 micron dry film down in the neighborhood of 25 and 30 micron that is really just a nod to try to be able to maintain some capability of putting a mill of copper in the hole because remember on outer layers were generally trying to plate the circuitry and the holes at the same time so your minimum plating thickness requirement in your hole is going to have a direct impact on what youre going to be building into those dry film valleys well call them to form your circuitry so we need to be aware of that because if we push much below the 25 micron range of line and s
