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Prior to high-temperature production steps, a cleaning process called RCA clean is used to reduce wafer impurities and prevent tool contamination. Silicon wafers are loaded into PTFE Teflon cassettes for submersion in strong oxidants and acids. In RCA 1, a solution of ammonium hydroxide, hydrogen peroxide, and deionized water is used to remove organic particles for six minutes, followed by rinsing in deionized water. RCA 2 then removes metallic contaminants using a solution of hydrochloric acid, hydrogen peroxide, and deionized water at 75 degrees Celsius for six minutes.
