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a cleaning process is used prior to any high-temperature production step to reduce wafer surface impurities as well as prevent contamination of sensitive tools one of these cleaning processes is called the RCA clean a process engineer loads silicon wafers into PTFE Teflon cassettes these cassettes can withstand submersion in strong oxidants and acids [Music] the cleaning bars are filled with solution and heated up to a high temperature the first step known as RCA one is used to remove organic particles and residuals the solution contains a mixture of ammonium hydroxide hydrogen peroxide and deionized water the wafers are cleaned for six minutes followed by a cleaning cycle in deionized water the second step of the RCA cleaning process known as RCA 2 is used to remove metallic contaminants a solution of hydrochloric acid hydrogen peroxide and deionized water is mixed in a bath and heated to approximately 75 degrees Celsius once again wafers are submerged for six minutes before transfer